:Our vision is to transform how the world uses information to enrich life for all.Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.Our vision is to transform how the world uses information to enrich life for all.Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.Have you ever dreamed of giving to the development of groundbreaking technologies?Micron has an outstanding opportunity for a high energy, tenacious, bold, results driven individual with a strong work ethic and integrity to join our Wafer Level Packaging Technologies Team in Boise, Idaho.As an Advanced Package TD Process Integration Engineer at Micron, you will define technology requirements, build program plans, and secure resources to drive process technology development programs. More specifically, you will develop sophisticated interconnect technology solutions that include wafer to wafer bonding, using Hybrid Bonding, or Fusion bonding. You will integrate process flows that involve thinning of wafers and through wafer interconnect schemes. You will take ownership of these programs or projects through to deployment of technology nodes into our High-Volume Manufacturing (HVM) operations. You will develop a yield improvement and process margin improvement roadmap to ensure extended engagement with manufacturing to insure rapid yield ramps of new technology nodes and packaging solutions. Expectations are to work independently and set direction with alignment of leaders and partners and demonstrate the ability to guide individuals towards project objectives. You will be recognized as an authority in broader integration areas by peers in the manufacturing and technology development organizations. You will need to accept change and volatility and operate with a sense of urgency. Apply sound engineering principles and judgement, seek advice from eauthoritiesand make critical and timely decisions. You will need to advise and lead the work of others and ensure good communication, engagement and accountability leading to achievement of the program goals.Responsibilities and Duties include, but not limited to:Line MonitoringProject managementYield improvementDeveloping new line monitoring methods and processesData miningResolving critical metrics for line monitoringUse Micron systems for conducting experimental work and documenting outcomesAnalysis of results from experiments and providing clear and practical recommendations or decisionsWriting Engineering Change Notices and Change Management Documents (ECN and GCP)Leading problem-solving activitiesPerform Kempner-Tregoe (KT) or KT-like problem solving and decision-making processDefine and implement Design of Experiment (DoE)Communications - same site and site-to-sitePresent to othersCoordinating conversion timelinesDevelop and innovate, establish contingency plansDrive process innovation for best in class solutions and cost driven technologyVertical integration capability to define highly complex process flowFocus on reliability and a \xe2\x80\x9cshift left\xe2\x80\x9d mentality and approach to technology developmentCoaching & MentoringCoaching and mentoring early and mid-career engineers (E1-E3) and techniciansInstructing classes as neededGrowth MindsetContinue to build new skills through development goals and learning eventsSeek out opportunities to work multi-functionally, build a network, and gain competency across domainsQualifications and SkillsAt least 5 years experience in advanced packaging industryDeep knowledge advanced package integration and DRAM or other memory. (3DIC, FO, Hybrid bond...etc)Excellent data extraction, analysis and reporting skills. (System analytics, JMP\xe2\x80\xa6etc)Ability to be flexible with job responsibilities and take the initiative to assume added responsibilitiesSuccessfully demonstrated collaboration skills with a focus on developing good team dynamicsSkill at effectively prioritizing multiple and sophisticated tasks.Good communication skill to align the perspective through multi-functional teamsTenacity to work effectively under tight timelines and limited resourcesAbility to self-direct and measure with minimal directionFluent communication in EnglishEducation:
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